Power Module DIP-IPM PS21994
Factor 2.466: Performance Factor 1.50:
Environmental Load Factor 1.644
Power module for driving inverters for home appliances and industrial motors.
Detailed equipment data
- Use of a high heat dissipation insulation structure achieved a reduced junction temperature rise in power chips. This allowed for a smaller package and led to a significant reduction (about 40%) of the mounting area on the PCB compared to our current products.
- By integrating a full-gate CSTBT™*, which is one of Mitsubishi Electric's advanced IGBTs, electric power consumption in the system was reduced.
*CSTBT: Carrier Stored Trench Gate Bipolar Transistor
- Introduction of lead-free process for soldering power chips and plating outer terminals realized all lead-free products (RoHS compliant).
Awarded the 52nd Okochi Prize
(Production award)
At the 52nd (2006) Okochi Prize ceremony held on March 14, 2006, the Dual Inline Package-type Intelligent Power Module (DIP-IPM) developed by Mitsubishi Electric's Power Device Works was awarded the Okochi Memorial Foundation Manufacturing Prize for the development and production of a transfer mold intelligent power module. In making its decision, the selection committee praised the development of a highly reliable, low-cost part using a transfer mold to unify multiple power chips, comprising inverter power circuits, with controller ICs. The DIP-IPM is being adopted increasingly for use in not only major appliances using inverters but also for induction heating devices and in the industrial devices market.
