Main Products and Business Lines
Power modules, high-frequency devices, optical devices, LCD devices, printed circuit boards, system LSIs, and others.
By using high-heat radiation insulating sheets, Mitsubishi Electric has decreased the size of packaging for inverter products to 60% (15A/600V) of conventional size, making it possible to reduce the dimensions of inverter products for home electronics. The packaging is eco-oriented and completely lead-free.
Mitsubishi Electric-developed HVIC*1 technology drives semiconductor elements for switching on AC400V outlet inverter systems. It boasts the industry's leading voltage resistance, able to withstand 1200 volts. Compliant with RoHS*2 standards, it can also be used with products destined for overseas markets.
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- HVIC: High Voltage Integrated Circuit
- *2
- RoHS: European Union directive on "restriction of the use of six certain hazardous substances in electrical and electronic equipment"
Mitsubishi Electric developed compact optical transceivers that are compliant with XFP MSA* and feature power-saving performance that is among the leading in the industry.
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- XFP MSA: 10Gbps(X) Form-factor Pluggable Multi-Source Agreement (An industry standard for 10 Gbps optical communication transceiver modules). The standard was formulated through the participation of a number of manufacturers in the optical communications industry, with the goal of achieving a common format for transmission standards such as SONET, SHD, Fiber Channel and Ethernet.
Mitsubishi Electric has developed power amplifier modules equipped with standard power circuits. The modules boast the industry's top-class power-added efficiency, enabling the manufacture of mobile handsets with fewer components and contributing to more compact designs.
Mitsubishi Electric developed 15-inch XGA thin-film transistor LCD modules, which, at 1500 cd/m2, achieve the industry's highest brightness among modules with edge lighting. Combined with an industry-leading 650:1 contrast ratio, the modules provide for great visibility even outdoors in strong sunlight.
Our ultra-thin, high-density, all-glass cloth epoxy buildup substrates are ideal for use in motherboards and modules for the latest mobile devices. They are also used in substrates for thin, high-definition semiconductor packaging.