Manufacturing Technology
Technology for Electrolyte Plating Machine
This is a technology about the machine for forming plated film on the substrate (wafer) of semiconductor, etc. The adoption of face-up type plating cup, with the wafer treating side facing up, provides a high-precision plating process with high stability of the plating solution.
Features of Technology
This technology has the following features and provides the effects given below regarding the configuration of the plating cup. The wafer is set in the plating cup with the treating side facing up, and the plating solution, introduced through the liquid blast nozzle located at the top of the cup, passes through the mesh anode to reach the wafer surface. The solution then passes again through the anode before being discharged through the discharge port at the top of the cup. (Face up system)
- Effect-1:
- The electric potential of wafer (cathode) in each cup is independent, preventing the current leakage between cups. (Japanese Utility Model No. 2141226)
- Effect-2:
- The uniformity of plating film thickness can be improved by adjusting the liquid blast nozzle position up down. (U.S. Patent No. 5,441,629; French Patent No. 2,703,365)
- Effect-3:
- The plating solution can be prevented from oxidation and can have the stability improved by sealing the aforesaid cup and plating solution circulation system in the atmosphere of a perfect, inert gas. (U.S. Patent Nos.5, 441,629; French Patent Nos.2, 703,365)
Main Application Fields
- Bump plating machine for semiconductor integrated circuit
- Fine-wiring plating machine
Conditions for Transfer of Technology
1. Utility Model No. 2141226
U. S. Patent No. 5,441,629; French Patent No. 9401647
Fig.1 Section of Wafer Treating Cup
