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July 5,1999
Hitachi, Ltd.
Intel Corporation
Mitsubishi Electric Corporation
Sharp Corporation
FOUR SEMICONDUCTOR MANUFACTURERS
AGREE TO UNIFIED SPECIFICATION FOR STACKED CHIP SCALE PACKAGES
Hitachi, Ltd., Intel Corporation,
Mitsubishi Electric Corporation, and Sharp Corporation today announced
an agreement to standardize specifications for stacked chip scale
packages (S-CSP), a multiple memory module for mobile communications
and hand-held computing applications. With today's announcement,
Intel and Hitachi join Sharp and Mitsubishi Electric, the two companies
that first proposed the S-CSP specifications standardization in
September 1998. In addition to the four companies entering into
the agreement above, five other companies, including both semiconductor
manufacturers and semiconductor assembly manufacturers, will support
the unified S-CSP specifications.
The expansion of the unified specifications group
will help meet the growing demand for S-CSP products in the worldwide
market for mobile communications and hand-held computing devices.
Although volume production of S-CSP devices has been underway since
April 1998, the addition of two new members to the unified specification
agreement will help speed its adoption as the de facto standard
for the world semiconductor industry. In addition, the group will
contribute to the diversification of S-CSP devices and will also
support users by creating smaller, lighter and highly reliable advanced
products in applications markets including mobile phones and hand-held
computers.
[Specifics of Unified Specifications]
*Specifications of S-CSP with Flash memory and
SRAM chips stacked in one package
- Compatibility of Pin Assign
- Unification of ball layout, ball pitch
(64pin, 72pin, ball pitch: 0.8mm)
- Unification of package size
(Size: 8x8, 8x10, 8x11, 8x12 mm, Height: 1.4mm
MAX)
[Additional Companies agreeing to support unified
specifications of S-CSP packages]
<Semiconductor manufacturers>
- Seiko Epson Corporation (Japan)
- Sanyo Electric Co., Ltd. (Japan)
<Semiconductor Assembly Manufacturers>
- Mitsui High-tec Inc. (Japan)
- Amkor Technology, Inc. (U.S.A.)
- Power Technology, Inc. (Taiwan)
<Sectional Structure of Stacked CSP
Complex Memory*1>
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