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Mitsubishi Electric and Kyocera Introduce World's First Dual-Band Compatible E-GSM/DCS Transmitter Module

High-Performance Integrated Module Occupies
Only 0.24 Cubic Centimeters

SUNNYVALE, Calif.--July 9, 2001-- The Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc., today announced that its parent, Mitsubishi Electric Corporation, and the Electronic Component Group of Kyocera Corporation have introduced the world's first dual-band compatible E-GSM(1)/DCS(2) transmitter module for mobile phone applications. Occupying only 0.24 cubic centimeters, the new transmitter module includes the antenna switch module, power amplifier, and coupler components as well as an EN61000-compliant electrostatic discharge (ESD) protection circuit in the same unit. Power efficiency improvements contribute to reduced module size and a 20 percent increase in mobile phone talking time. The module's high integration makes designing an external impedance-matching circuit unnecessary, thereby shortening development time and saving engineering resources.

"This collaboration between Mitsubishi Electric and Kyocera effectively showcases key technologies of each company for next-generation cell phones and streamlines the design process for customers," said Bryon Gutow, senior product marketing manager for microwave and RF products at Mitsubishi Electric & Electronics USA, Inc. "Making external impedance matching circuit design unnecessary means customers can focus resources on activity that will drive their products to market faster. In addition, this dual-band power amplifier further exemplifies Mitsubishi Electric's design capabilities to meet the need for the higher level of integration that cell phone manufacturers require."

The module leverages technological strengths from each company: Mitsubishi Electric's module and gallium arsenide (GaAs) HBT(3) MMIC(4) design and manufacturing technologies; and Kyocera's LTCC(5) and antenna switch module technologies. The module achieves power efficiency improvements on the antenna edge of the module by combining the high-efficiency GaAs HBT MMIC, power amplifier, and the low?loss antenna switch module together and optimizing the design of the coupler and matching circuit. As a result, the module achieves a 43.4 percent efficiency for E-GSM transmissions at 33 dBm -10 percent higher than conventional solutions. DCS transmissions realize a 31.1 percent efficiency at 30 dBm.

The module's ESD protection circuit can provide electrostatic discharge protection up to +/-4 Kvolts, which is required by the European Union EN61000 standard.

The module's extremely small size - 12.0 x 10.0 x 2.0 millimeters - enables it to take only one-third of the board space of previous-generation modules.

Availability

Mitsubishi Electric will sample the dual-band compatible E-GSM/DCS transmitter module in August 2001, with volume production in February 2002. Kyocera will begin volume production in the second quarter of 2002.

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Definitions:
(1) E-GSM - Enhanced - Global System for Mobile Communication
(2) DCS - Digital Cellular System
(3) HBT - Heterojunction Bipolar Transistor
(4) MMIC - Microwave Monolithic Integrated Circuit
(5) LTCC - Low Temperature Co-fired Ceramic

About Kyocera Corporation

Kyocera Corp., the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of advanced ceramics. By combining these engineered materials with materials and plastics, and integrating them with other technologies, Kyocera has become a leading supplier of telecommunications equipment, semiconductor packages, electronic components, cameras, laser printers, copiers, solar energy systems and industrial ceramics. During the year ended March 31, 2001, Kyocera Corp.'s consolidated net sales totaled 1.285 trillion yen (US$ 10.2 billion) with net income of 219.5 billion yen (US$ 1.742 billion). Kyocera Corp. has been recognized by IndustryWeek magazine as one of "The World's 100 Best-Managed Companies."

About Mitsubishi Electric & Electronics USA, Inc.

Mitsubishi Electric Corporation manufactures a diverse range of microwave and RF semiconductors for linear, low-noise and high-power communications applications, including satellite and terrestrial transmitters and receivers, marine and vehicular mobile radios, cellular phones and subscriber units. The company produces gallium arsenide (GaAs) FETs, HBTs, MICs, MMICs and HEMTs; silicon RF power transistors and modules; and surface acoustic wave (SAW) filters for the industrial and consumer markets. Mitsubishi markets its microwave and RF semiconductors in North America through the Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc.

Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electric & Electronics USA, Inc. are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including embedded DRAM/flash/SRAM, ASIC, ASSP, MCU, discrete memory, graphics, microwave/RF, optoelectronic, and flat-panel display products.

Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com.

Keywords
Mitsubishi, GaAs HBT, E-GSM, DCS, transmitter, microwave.


Editorial Contacts:
Mitsubishi Electric & Electronics USA, Inc.
John Garner
garner_john@edg.mea.com

Positio Investor & Public Relations (for Mitsubishi)
Dave Richardson
(650) 815-1006, Ext. 108
dave@positiopr.com

Kyocera Corporation
Hose Hayata, +81-75-604-3514
(408) 774-3191
hose-hayata@kyocera.co.jp

Takuro Takeshima, +81-75-604-3514
takuro-takeshima@kyocera.co.jp

Elly Yoshikawa, +81-75-604-3514
elly-yoshikawa@kyocera.co.jp
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