SUNNYVALE, Calif. -- August 13, 2002 -- The Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc., today introduced the M69850, the world's first SOI-CMOS single-chip, 10 gigabit (Gbit) Ethernet physical-layer transceiver LSI^[1] (LAN-PHY LSI). SOI-CMOS technology enables the M69850 to integrate XGXS^[2], PCS^[3], and PMA^[4] functions into one chip that uses a single, 1.8-volt power supply. SOI-CMOS technology can provide faster transistors for better performance and less substrate noise for lower jitter level, as well as latch-up prevention. The M69850 is targeted to meet the industry demand to upgrade data transmission speed in local area networks (LANs) and metropolitan area networks (MANs).

Designed for 10 gigabit per second (Gbps) Ethernet optical module, digital cross connect, network router, and network switch applications, the M69850 is compliant with ongoing XENPAK Multi-Source Agreement standardization and conforms to the IEEE802.3ae standard.

"SOI-CMOS technology enables customers to have a more integrated, more reliable, and more cost-effective high-speed analog solution than products using gallium arsenide, bipolar, or BiCMOS technologies," said Daniel Chen, assistant vice president of high-frequency products for Mitsubishi Electric & Electronics USA, Inc.

M69850 Features
The chip's XGXS, PCS, and PMA blocks incorporate serializer/deserializer, phase-locked loop (PLL), clock data recovery (CDR), transmitter/receiver elastic FIFO^[5], 8- to 10-bit encoder/decoder, 64- to 66-bit encoder/decoder, and gearbox functions. These functions provide the data conversion between the 10.3-Gbit PMA and 3.125-Gbit XAUI^[6] interfaces. An industry-standard XAUI-PMD^[7] interface service employs a differential low-voltage-swing, AC-coupled interface to reduce power consumption. The device also provides an MDIO^[8] interface to provide full IEEE802.3ae compatibility.

The M69850 provides designers with a flexible clock scheme, giving them a choice between a 156.25-MHz voltage-controlled oscillator and 156.25-MHz or 644.53-MHz external reference clocks. Other advanced features include comma detection and byte alignment, deskewing and channel-to-channel alignment functions for data alignment, as well as loopback and built-in PRBS^[9] pattern generator for module testing.

Additional Capabilities

-	On-chip clock data recovery, requiring no external reference clocks
-	Support for standard I2CTM interface for peripheral interface
-	Adjustable fiber and XAUI output levels
-	Small package design for XENPAK-compliant heat dissipation and low electromagnetic interference (EMI)

Packaging and Availability
The M69850 single-chip Ethernet physical-layer transceiver LSI is available in an industry-standard 289-pin ball grid array (BGA) package. Samples will be available in September, with volume production scheduled for the fourth quarter of 2002.

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Definitions
[1] LSI = Large Scale Integrated Circuit
[2] XGXS = XGMII Extender Sublayer
[3] PCS = Physical Coding Sublayer
[4] PMA = Physical Medium Attachment
[5] FIFO = First In, First Out
[6] XAUI = 10 Gigabit Attachment Unit Interface
[7] PMD = Physical Medium Dependent
[8] MDIO = Management Data Input/Output
[9] PRBS = Pseudo Random Bit Sequence

About Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation offers a diverse range of optoelectronic products for SDH, SONET, CWDM, DWDM, data communication, and FITL applications, as well as passive optical network systems, test and instrumentation applications, and CATV distribution. The company markets its optoelectronic products in North America through the Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi Electric combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including DRAM, flash, SRAM, ASIC, ASSP, MCU, microwave/RF, and optoelectronic devices.
Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/.

Trademark Information
Mitsubishi and the Mitsubishi logo are registered trademarks of Mitsubishi Electric Corporation in the U.S.A., Japan, and other countries. I²C (Inter Integrated Circuit) is a trademark of Philips Semiconductors.

Keywords
Mitsubishi, optoelectronic, network, LAN, MAN, XENPAK, Ethernet, 10 Gigabit, 10 Gbps, 10 Gb/s.

Editorial Contacts: Positio Investor & Public Relations Dave Richardson (650) 815-1006, Ext. 108 dave@positiopr.com Mitsubishi Electric & Electronics USA, Inc. John Garner (408) 774-3191 garner_john@edg.mea.com