SUNNYVALE, Calif. -- November 20, 2002 -- The Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc., a leading Low-Power SRAM (LPSRAM) supplier, announced a new ultra-small, cost-effective 16-megabit (Mbit) LPSRAM that fits into a 48-ball FBGA^[1] chip-scale package with a 7.5-mm by 8.5-mm footprint. Ideal for cellular handsets and other space-constrained applications, the new device achieves the 16-Mbit density by stacking two 8-Mbit LPSRAM die into one package.

"As our customers migrate to the 16-Mbit density, they have two requirements: keep the package size small and keep the cost-per-bit down," said Tad Keeley, senior product marketing manager for SRAMs at Mitsubishi Electric & Electronics USA, Inc. "By leveraging our leading-edge packaging technology, we have produced a 16--Mbit LPSRAM in the smallest package available in the industry. We also reduced costs by leveraging our current LPSRAM process technology and have passed this benefit on to our customers."

The new 16-Mbit LPSRAM is both forward and backward compatible with Mitsubishi Electric's 4- to 32-Mbit LPSRAM family, allowing easy migration to higher or lower density SRAMs that use the same FBGA package. The new 16-Mbit LPSRAM is also available in a 52-pin µTSOP^[2] package with a 10.49-mm by 10.79-mm footprint.

Manufactured in 0.18-µm CMOS process technology, Mitsubishi Electric's 16-Mbit LPSRAM requires a single, 2.7-3.6 volt power supply and provides a standby current of 1 µA at 3.0 volts (typical). The LPSRAM provides access times as fast as 70 nanoseconds and operates throughout an industrial temperature range (-40 to +85 degrees Celsius) for increased durability.

Availability
Samples of the FBGA (M5M5J167WG) and µTSOP (M5M5J167KT) package versions of Mitsubishi Electric's 16-Mbit LPSRAM are available now, with volume production scheduled for January 2003.

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Definitions
[1] FBGA = Fine-Pitch Ball Grid Array
[2] µTSOP = Micro Thin Small Outline Package

About Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation is one of the leaders in providing high-speed and low-power SRAM products in small package sizes, and is known throughout the industry as a market-driven memory supplier to its OEM customer base. The company typically supports low-power SRAM products over many process generations and has supported the 256-Kbit product since 1985. Mitsubishi Electric also combines its low-power SRAMs with its DINOR BGO flash memory in its leading-edge MCP packaging technology for cellular handset applications.
Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi Electric combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including microcontroller, ASSP, ASIC, flash, SRAM, DRAM, optoelectronic, and microwave/RF devices.
Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/.

Trademark Information
Mitsubishi and the Mitsubishi logo are registered trademarks of Mitsubishi Electric Corporation in the USA, Japan, and other countries. All other companies and products referenced herein are trademarks or registered trademarks of their respective holders.

Keywords
Mitsubishi, SRAM, Low-Power SRAM, LPSRAM, FBGA, Cellular, Wireless, Mobile.

Editorial Contacts: Positio Investor & Public Relations Dave Richardson (650) 815-1006, Ext. 108 dave@positiopr.com Mitsubishi Electric & Electronics USA, Inc. John Garner (408) 774-3191 garner_john@edg.mea.com

Customer Contact: (408) 774-3189 customerservice@edg.mea.com