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MITSUBISHI ELECTRIC INTRODUCES NEW FAMILY OF COST-EFFECTIVE,
HIGH-LINEARITY, SURFACE-MOUNT POWER GaAs FETS FOR WIRELESS APPLICATIONS
New Low-Cost Packaging Technology Dramatically Improves RF Performance
SUNNYVALE, Calif. -- January 15, 2003 --
The Electronic Device Group of Mitsubishi Electric & Electronics
USA, Inc., today introduced the first two devices in the new MGF095XP
power GaAs FET[1] family. The devices
demonstrate exceptional linearity at frequencies from cellular bands
through U-NII band (5.725 - 5.825 GHz). They are available in a
new low-cost, plastic mold, lead-frame package that improves heat
dissipation for enhanced RF performance and reliability. Occupying
a tiny 4.5-mm x 3.4-mm footprint, the devices are ideally suited
to automated manufacturing environments, such as the reflow process.
"Customers employing complex modulation schemes in their designs
will appreciate the outstanding linearity performance and advanced
packaging technology characteristics of the MGF095XP family,"
said Bryon Gutow, senior product marketing manager for microwave
and RF products at Mitsubishi Electric & Electronics USA, Inc.
"Additionally, the low-cost nature of these devices make them
a good fit for applications as diverse as wireless LANs, receiver
amplifiers, and tower-top antennas, as well as the driver and output
stages in basestation transmitters."
Both power GaAs FET devices feature IM3[2]
performance of -45 dBc with 50 percent power added efficiency. The
IP3[3] performance is 42 dBm for the MGF0951P
device and 47.5 dBm for the MGF0952P device.
Technology improvements in the MGF095XP family improve the power
output, gain, and reliability of the devices. The MGF0951P offers
+31 dBm of output power with 13 dB of gain (at 2.15 GHz) and a thermal
resistance of 20 degrees C per watt. The MGF0952P has +36.5 dBm
of output power with 13.5 dB of gain (at 2.15 GHz) and a thermal
resistance of 5 degrees C per watt.
Availability
Samples are now available for the MGF0951P and MGF0952P devices,
with volume production scheduled for April 2003.
# # #
Definitions:
[1] GaAs FET --gallium arsenide field effect transistor
[2] IM3 -- Abbreviation for third-order intermodulation distortion
products resulting from non-linear behavior of a semiconductor device.
[3] IP3 -- Abbreviation for third-order intercept point. Related
to the output power and IM3. Measure of semiconductor device linearity.
About Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation manufactures a diverse range
of microwave and RF semiconductors for linear, low-noise, and high-power
communications applications, including satellite and terrestrial
transmitters and receivers, mobile radios, cellular phones, and
subscriber units. The company produces gallium-arsenide (GaAs) FETs,
modules, and MMICs using HBT, PHEMT, MESFET, HEMT, and HFET technologies.
The company also produces silicon RF power transistors and modules
using MOS and LDMOS technologies for the industrial and consumer
markets. Mitsubishi Electric markets its microwave and RF semiconductors
in North America through the Electronic Device Group of Mitsubishi
Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation and its North American affiliate,
Mitsubishi Electric & Electronics USA, Inc., are world-class
suppliers of semiconductors and electronic products for communications,
industrial, Internet-enabled, automotive, and visual applications.
Mitsubishi Electric combines its systems-level expertise and high-level
silicon process technologies to provide chip, chipset, and system-on-chip
solutions. The company is ranked among the top-tier worldwide semiconductor
suppliers and offers an extensive range of semiconductor and computer
system components for the North American marketplace, including
DRAM, flash, SRAM, ASIC, ASSP, MCU, microwave/RF, and optoelectronic
devices.
Additional information on the Mitsubishi Electric Semiconductor
Group is available at http://www.mitsubishichips.com/.
Keywords
Mitsubishi, GaAs FET, PCS, GSM, CDMA, TDMA, W-CDMA, U-NII, MMDS,
ITFS, AMPS, SMD, SMT, fixed wireless, microwave, RF, radio frequency.
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Editorial Contacts:
Positio Investor & Public Relations
Dave Richardson
(650) 815-1006, Ext. 108
dave@positiopr.com
Mitsubishi Electric & Electronics USA, Inc.
John Garner
(408) 774-3191
garner_john@edg.mea.com
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Customer Contact:
(408) 774-3189
customerservice@edg.mea.com |
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