SUNNYVALE, Calif. -- March 5, 2003 -- The Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc., today introduced uncooled 10-gigabit-per-second Ethernet (10-GbE) TOSA^[1] and ROSA^[2] modules for XENPAK, X2, and XPAK applications. While other 10-GbE TOSA and ROSA modules are currently offered, these are the industry's first to be available in an industry-standard, coaxial JEDEC TO can package, providing the same high-level performance at a much lower cost. When used together, Mitsubishi Electric's 10-GbE TOSA and ROSA modules achieve a 10-km transmission distance, which is ideal for long-reach Ethernet applications.

"We believe the price point of our new TOSA and ROSA modules will encourage their widespread market adoption," said Daniel Chen, assistant vice president of optoelectronic and high-frequency products for Mitsubishi Electric & Electronics USA, Inc. "We combined our expertise in high-speed optical transmitter and receiver design with our knowledge of semiconductor packaging technology to have these high-quality, competitively priced products available upon demand. Mitsubishi Electric continues to invest in optoelectronic products that solve near-future networking problems for data communications and telecommunications applications."

The modules feature newly designed electrical signal interfaces that use differential inputs (for the TOSA) and outputs (for the ROSA) to provide exceptional electrical performance over 10 GHz. The modules operate throughout a wide temperature range (0 to +80 degrees Celsius) without a thermoelectric cooler, thereby reducing package size, power consumption, and cost. Space and cost are reduced further by using a standard coaxial JEDEC TO can package, enabling the modules to have a 7.0-mm diameter and a length of 15.3 mm (TOSA) or 11.5 mm (ROSA).

The TOSA module incorporates a distributed feedback (DFB) laser diode that operates in the 1260- to 1355-nm wavelength range with an average optical power output of -2 dBm and an extremely low power consumption of 100 mW. The module's 50-ohm differential input impedance eliminates common noise for high data-rate transmissions. In addition to the DFB laser diode, the TOSA module also contains a miniaturized optical isolator, bias circuits, and a single-mode optical fiber stub (SC ferrule).

The ROSA module contains a PIN photodiode^[3] with a low-noise transimpedance preamplifier. The module's high typical sensitivity of -16 dBm in optical modulation amplitude (OMA) enables it to detect optical signals transmitted up to 10 km. The ROSA module demonstrates a responsivity of 0.85 amperes per watt (A/W).

A technical paper on the base technology used in the 10-GbE TOSA and ROSA modules will be presented at the Optical Fiber Communication Conference & Exhibition (OFC 2003), which takes place March 23-28, 2003, in Atlanta, Ga. For more information on OFC 2003, please visit http://www.ofcconference.com/

Availability

Samples of the TOSA (FU185SDF) and ROSA (FU135SPP) modules will be available in May 2003, with volume production scheduled for July 2003.

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Definitions
[1] TOSA -- Transmitter Optical Subassembly
[2] ROSA -- Receiver Optical Subassembly
[3] PIN photodiode -- A diode with a large intrinsic region sandwiched
between P-doped and N-doped semiconducting regions.

About Mitsubishi Electric & Electronics USA, Inc.
Mitsubishi Electric Corporation offers a diverse range of optoelectronic products for SDH, SONET, 10-GbE, CWDM, DWDM, data communication, and OTDR applications, as well as passive optical network systems, test and instrumentation applications, and CATV distribution. The company's optoelectronic product families conform to leading-edge current and future multi-source agreements such as XENPAK, X2, XPAK, and XFP. Mitsubishi Electric markets its optoelectronic products in North America through the Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc.

Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi
Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi Electric combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including microcontroller, ASSP, ASIC, flash, SRAM, DRAM, optoelectronic, and microwave/RF devices.

Additional information on the Mitsubishi Electric Semiconductor Group is
available at http://www.mitsubishichips.com/

Trademark Information
Mitsubishi and the Mitsubishi logo are registered trademarks of Mitsubishi
Electric Corporation in the U.S.A., Japan, and other countries.

Keywords
Mitsubishi, optoelectronic, TOSA, ROSA, transmitter optical subassembly,
receiver optical subassembly, optical transmitter, optical receiver,
Ethernet, 10-Gigabit Ethernet, 10-GbE, 10GbE, 10-Gigabit, XENPAK, X2, XPAK

 

Editorial Contacts: Positio Investor & Public Relations Dave Richardson (650) 815-1006, Ext. 108 dave@positiopr.com Mitsubishi Electric & Electronics USA, Inc. John Garner (408) 774-3191 garner_john@edg.mea.com

Customer Contact: (408) 774-3189 customerservice@edg.mea.com